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Microscale Thermal and Power Management
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what's new

New products and new options in thermal and power management

Nextreme’s scalable, thin-film thermoelectric products continue to evolve. With minimal changes to its manufacturing processes and circuit design, Nextreme is discovering new solutions for thermal and power management issues.

Check out what's new in:
Press Releases | Media Coverage | Conferences | Awards | Image Gallery

Visit Nextreme Labs for the latest discoveries in thermal management and power generation.

Media Inquires
If you are a member of the press and want more background information on the company, leadership or technology, click on one of the links below.

Company Snapshot (PDF)
Leadership Team Backgrounder (PDF)
Product and Technology Overview (PDF)

Media Contacts:  Karl von Gunten

Visit the Image Gallery to download the company logo and product images.

recent press releases


July 2010 [PDF] Nextreme Expands Engineering Consulting Services to Rapidly Solve Thermal And Power Management Issues

July 2010 RTI International, Nextreme Thermal Solutions 'Hot Spot' Electronics Chip Cooler Technology Earns R&D 100 Award

March 2010 [PDF] Nextreme Appoints Jim Mundell as Chief Operating Officer

January 2010 [PDF] Nextreme Demonstrates Laser Cooling for TO-Can Packages

December 2009 [PDF] Nextreme Announces High Temperature Gold-Tin Thermoelectric Module for Optoelectronic Cooling

November 2009 [PDF] Nextreme and Infinite Power Solutions Announce Thin-Film Thermal Charger Application

October 2009 [PDF] Nextreme's OptoCooler HV14 Passes Stringent 3000g Shock Testing Standard

July 2009 [PDF] Nextreme and Lockheed Martin Announce Cooperation Agreement for Development of Next Generation Thermal and Power Management Solutions

View press release archive >