Nextreme and Nucletron Technologies GmbH Agree to Sell Thin-film Thermoelectric Products in Europe

Agreement creates first sales and marketing foothold in Europe for Nextreme…

DURHAM, N.C. (April 29, 2009) — Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, and Nucletron Technologies GmbH, a leading source for high tech systems and components in Europe, have entered into a distribution agreement under which Nucletron will distribute Nextreme’s thin-film thermoelectric products in Europe. The distribution agreement opens up Nextreme’s first sales and marketing channel in Europe.

Nextreme is focused on solving thermal issues that are becoming widespread in the electronics industry. The company manufactures thin-film thermoelectric devices that act as solid-state heat pumps for cooling and temperature control of electronic and optoelectronic components used in a variety of industry applications. The same technology can generate electrical power from waste heat.

"Interest in our technology from the international markets has grown significantly this year," said Dr. Paul A. Magill, vice president of marketing and business development for Nextreme. “Nucletron sees the value in our next generation thermal management products and is excited to represent Nextreme as a distributor.”

Nucletron Technologies GmbH is a wholly owned subsidiary of Nucletron Electronic AG, a Germany-based holding company with subsidiaries engaged in the production and distribution of components, systems and subsystems for a number of markets, including environmental, medical and analysis, photovoltaics, communication, aerospace, industry electronics, government, microwave, isolation and safety.

In addition to opening up new markets in Europe, Nextreme will benefit from Nucletron's insight into thermal management issues that are impacting product development in these markets.

"With Nextreme’s technology, we see a great opportunity to address the growing thermal management issues in electronics," said Robert Tittl, managing director of Nucletron Technologies GmbH.  "We also see a growing demand for technologies that tap into alternative energy sources."

Nextreme's thin-film thermoelectric products are manufactured in volume with the copper pillar bump process, an established electronic packaging approach that scales well into large arrays. The thermal copper pillar bump process integrates thin-film thermoelectric material into the solder-bumped interconnects that provide mechanical and electrical connections for today's high performance/high density integrated circuits.

Nextreme and Nucletron will be exhibiting at the LASER. World of Photonics trade fair in Munich, Germany June 15-18.

For more information, contact Nextreme at 3908 Patriot Dr., Suite 140, Durham, NC 27703-8031; call (919)-597-7300; e-mail info@nextreme.com; or go to www.nextreme.com.

About Nextreme Thermal Solutions™, Inc.
Nextreme Thermal Solutions designs and manufactures microscale thermal and power management products for the electronics, telecommunications, semiconductor, consumer, and aerospace/government industries. The company uses breakthrough thin-film thermoelectric material to embed cooling, temperature control and power generation capabilities into the widely accepted copper pillar bumping process used in high-volume electronic packaging. Nextreme's headquarters and manufacturing facility are based near Research Triangle Park, North Carolina.

About Nucletron Technologies GmbH
For more than 50 years, Nucletron Technologies GmbH has been the leading source for high tech systems and components in Central Europe. The company has developed special expertise and extensive know-how in the manufacturing and sales of hi-tech leading edge technologies and is well established and suited for introducing new, pioneering technologies to a market that has never before seen such solutions. For more information, visit www.nucletron.de.

view all news