Nextreme Honored By Advanced Packaging With 2007 Thermal Management Technology Award

Nextreme’s miniature thin film eTEC™ receives thermal management award…

Research Triangle Park, N.C. (August 1, 2007) – Nextreme, a leading manufacturer of advanced thermoelectric components that address thermal management and power generation needs of the semiconductor, photonics, test-and-measurement and defense/aerospace industries, has received Advanced Packaging Magazine’s 2007 Thermal Management Technology Award for its miniature, thin film embedded thermoelectric component (eTEC™) technology.

“The Advanced Packaging Awards honor novel solutions, innovative technologies and technological advancements, and we are very pleased that the eTEC has been recognized as a leading technology,” said Jesko von Windheim, CEO at Nextreme. “This award recognizes our progress in advancing thin film technology to provide customers with a unique, miniaturized approach to delivering thermal management solutions.”

Manufactured using semiconductor processing techniques, the paper-thin eTEC can be seamlessly embedded into applications for cooling, heating and power generation requirements.

The event was held in San Francisco, California at the San Francisco Museum of Modern Art. The award recipients were honored with Advanced Packaging glass statuettes in recognition of their achievements.

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