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Nextreme Funds Heat Transport Research at the University of Waterloo
Nextreme partners with research pioneers in electronic heat transfer
Research Triangle Park, N.C. (April 26, 2007) Nextreme, a leading manufacturer of advanced thermoelectric components that address thermal management and power generation needs of the semiconductor, photonics, test-and-measurement and defense/aerospace industries, announced research funding for the Microelectronics Heat Transfer Lab (MHTL), located at the University of Waterloo, Ontario, Canada. The MHTL program was created to implement Nextreme’s unique embedded thermoelectric component (eTEC™) technology in novel, system-level thermal management and power generation applications.
“MHTL is a pioneer in electronic heat transfer with a long history in design, implementation and testing of the most advanced heat transport methods”, said Jesko von Windheim, CEO of Nextreme, “We look forward to a strong and continued partnership as we strive to create ground-breaking thermal and power generation solutions at the system level.”
Nextreme has contributed more than C$300,000 to development work at MHTL.
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