Download Data Sheet | Application Note

The OptoCooler™ Ultra-High Packing Fraction UPF4 module addresses the latest cooling and temperature control requirements for optoelectronics, electronics, medical, aerospace/government applications. This module was developed in response to market demand for microscale cooling solutions that improve the performance of electronics without sacrificing efficiency. The module has been optimized for laser diode, LED and advanced sensor applications.

The OptoCooler UPF4 module removes a maximum of 420 mW of heat at 25°C ambient in an active footprint of only 0.55 mm². As a result, the module can pump a heat density up to 78 W/cm². At 85°C, these values increase to 610 mW and 112 W/cm², respectively.

With Nextreme's thin-film thermal bump technology at its core, the OptoCooler module can be integrated directly into electronic and optoelectronic packaging to deliver more than 45°C of cooling for a wide variety of thermal management applications. For example, the module can be embedded within laser diode packages - devices that illuminate telecom fiber-optic cables - to control temperatures and maintain proper operating conditions for optimal performance. In addition, the module’s ultra-fast, millisecond-scale response time and broad temperature range capabilities can enable improved performance of the thermal cycling processes in a host of applications.

Perspective View

Side View

Samples Available Now

Product samples of the OptoCooler module are available now for customer qualification.

Contact us for evaluation, analysis, prototype, test, verification or production assistance, or call us at +1 919-597-7300.