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The eTEC™ HV56 module is the next product in its high-voltage (HV) line of thin-film thermoelectric coolers (TECs) designed to address electronics cooling applications with larger heat pumping requirements. At 85°C, the eTEC HV56 can pump 6 watts or 58 W/cm2 of heat in footprint of only 11 mm². The device is only 0.6mm high, making it the thinnest, highest heat pumping TEC on the market today.

At 85°C, the eTEC HV56 can create a temperature differential (ΔT) of up to 60°C between its hot and cold sides, and operates at a maximum voltage of 10.8V, making it compatible with commonly found board-level currents and voltages. At 25°C, the device can create a ΔT of up to 50°C with a maximum voltage of 8.8V.

The eTEC HV56 is RoHS-compliant and is manufactured using gold-tin (AuSn) solder, which enables assembly temperatures as high as 320°C. These assembly temperatures make the HV56 compatible with industry standard processes for packaging electronic devices that require tight tolerances.

The eTEC HV56 module is available with an 8 to 10 week delivery lead time. Pricing is available upon request.

Contact us for evaluation, analysis, prototype, test, verification or production assistance, or call us at +1 919-597-7300.