|
|
technology overview |
 |
Nextreme designs and manufactures micro-scale thermal and power management products that overcome thermal and power constraints in electronics for the semiconductor, photonics, consumer, automotive and defense/aerospace industries.
Nextreme's thermal copper pillar bump addresses the most challenging thermal and power management constraints in electronics today, and delivers the only fully-scalable technology solution by leveraging the existing, high-volume flip chip manufacturing infrastructure.
Nextreme's thermoelectric products make use of the Peltier Effect: When an electric current is driven through a circuit containing thermoelectric couples of two dissimilar materials, heat is absorbed at one junction (the cold side) and released at the other junction (the hot side). This enables the devices to either cool or heat whatever they are in contact with, depending on the applied dc polarity.
In addition, Nextreme’s devices can generate electricity via the Seebeck Effect, where electricity is produced from a temperature differential applied across the device.
Thermoelectric modules have been available for cooling and power generation for many decades; however, traditional thermoelectric modules have never penetrated the semiconductor marketplace due to the unique manufacturing processes required to integrate the functionality into the electronic package. In contrast, Nextreme's thermoelectric technology integrates seamlessly into the widely accepted copper pillar bumping process used by Intel, Amkor, Casio and others. The thermal copper pillar bump adds thermal capability to solder bumps that previously only provided mechanical and electrical functionality.
Nextreme’s approach uses proven, fully scalable technology to deliver new, enabling functionality in flip chip applications.
- One process provides discrete (stand alone) devices, chip-level integration, and wafer-level integration.
- Implementation requires a circuit design change and minimizes the need for manufacturing changes.
No technology other than Nextreme’s can address the industry's needs for micro-scale thermal and power management.
Contact us for evaluation, analysis, prototype, test, verification or production assistance, or call us at +1 919-597-7300.
|
