resources / links

Organizations

• RTI International's Center for Thermoelectrics Research
• International Thermoelectric Society
• IEEE Components, Packaging and Manufacturing Technology (CPMT) Society
• International Microelectronics and Packaging Society (IMAPS)
• Microelectronics Packaging and Test Engineering Council (MEPTEC)
• Materials Research Society (MRS)

Useful Web Sites

• Peltier Cooling, The Heat Sink Guide
• Peltier Device Information Directory

Technical Articles

• "Embedded Thermoelectric Coolers for High-performance ICs", Advanced Packaging, March, 2007.
• "Packaging Challenges For High Heat Flux Devices", Electronics Cooling, August, 2006.
• "Solid-State Microrefrigerator on a Chip", Electronics Cooling, August, 2006
• "Feasibility Study of Using Solid State Refrigeration Technologies for Electronic Cooling", Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06, June, 2006
• "Thin Film Thermoelectric Cooler Thermal Validation and Product Thermal Performance Estimation", Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06, June, 2006.
• "Use-Condition Thermal Metrics For Characterization of Thin Film TEC Modules on Electronic Packages", Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06, June, 2006.
• "Thermoelectric Mini-Contact Cooler For Hot-Spot Removal In High Power Devices", Electronic Components and Technology Conference (ECTC), 2006. Proceedings, May 30 - June 2, 2006.
• "Thermoelectric Materials, Phenomena, and Applications: A Bird's Eye View", MRS Bulletin, March, 2006.
• "Superlattice Microrefrigerators Fusion Bonded With Optoelectronic Devices", Components and Packaging Technologies, IEEE Transactions, December, 2005.
• "On One-Dimensional Analysis of Thermoelectric Modules (TEMs)", Components and Packaging Technologies, IEEE Transactions, June, 2005.
• "A Simple Experimental Technique for the Characterization of the Performance of Thermoelectric Coolers beyond 100°C", Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), March 2005.
• "Advances In High-Performance Cooling For Electronics", Electronics Cooling, November, 2005.
• "Nano and Micro Technology-Based Next-Generation Package-Level Cooling Solutions", Intel Technololgy Journal, November 9, 2005.
• "Latest Developments In Thermoelectrically Enhanced Heat Sinks", Electronics Cooling, August, 2005.
• "Generalized Thermal Analysis of Hotspots on a High Power Density Microprocessor Chip", Electronic Components and Technology Conference, 2005. June, 2005.
• "Extension of Air Cooling for High Power Processors", Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. June, 2004.
• "Leakage Current: Moore's Law Meets Static Power", IEEE Computer, December, 2003.
• "Air-cooling Extension - Performance Limits for Processor Cooling Applications", Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), March, 2003.