Products Overview
Nextreme designs and manufactures micro-scale thermal and power management products for the semiconductor, photonics, consumer, automotive and defense/aerospace industries.
Thermal Copper Pillar Bump - integration of thermoelectric material into the widely accepted copper pillar bumping process for cooling and power generation applications in high-volume electronic packaging, particularly in flip chip applications.
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OptoCooler™ Family - Nextreme's OptoCooler™ product family addresses the latest cooling and temperature control requirements for optoelectronics, electronics, medical military and aerospace applications. more >
Embedded thermoelectric cooler (eTEC™) - a miniature heat pump for rapid cooling and heating. Cools hot spots to improve performance, reliability, yield, and cost of high-performance CMOS ICs, RF components, HB-LEDs and other optoelectronic chips. Performs precision thermal management of temperature sensitive devices, such as photonics ICs, DNA analysis chips, and IC test systems. more >
Miniature thin-film thermoelectric generator (eTEG™) - enables recycling of heat to electricity. Ideal for waste heat conversion applications, the solid state eTEG delivers power generation densities (>3 W/cm2) in excess of those achieved using bulk materials and is optimized to provide power in a form factor that can be as much as 20x thinner than bulk material alternatives. more> |
