Nextreme Thermal Solutions - Data Sheets and Application Notes

Technical Specifications for Current Products

FOR COOLING AND TEMPERATURE CONTROL

First in a new class of RoHS-compliant high voltage / low current thermoelectric coolers optimized for standard circuitry and power requirements.

Operates at a maximum voltage of 2.9V and can pump a maximum of 1.7 watts of heat at 85°C in a footprint of only 2.8 mm²

Ideal for optoelectronics applications with high heat-flux requirements, particularly semiconductor optical amplifiers (SOA), laser diodes and LEDs

Produces a maximum of 3.7 W of cooling at 25°C in an active footprint of 5.1 mm² and can pump a heat flux in excess of 72 W/cm²

Available with wires attached or with wire bondable pads

Ultra-small thermoelectric module can be integrated directly into electronic and optoelectronic packaging to deliver more than 45°C of cooling for a wide variety of thermal management applications

Pumps a maximum of 420 mW of heat at 25°C ambient with an active footprint of only 0.55 mm² and can pump heat with a heat density >75 W/cm²

Miniature heat pumps for rapid cooling and heating

Cool hot spots for improved performance and increased reliability for high-performance CMOS ICs, RF components, HB-LEDs, laser diodes and other optoelectronic chips

Performs precision thermal management of temperature sensitive devices, such as photonic ICs, DNA analysis chips, and IC test systems

Available with or without wires attached

FOR POWER GENERATION

Thermoelectric Generator eTEG™ HV14

Download Data Brief

Demonstrated output power levels of >16mW at ΔT of 70°C and >45mW at ΔT of 120°C

Measures just 1.8mm x 1.5mm.

Has corresponding output power densities of ~ 0.6 and 1.6W/cm².

Can be arranged in custom arrays to match power generation requirements

Thermoelectric Generator eTEG™ UPF40

Download Data Sheet | Application Note

Enables reclamation of waste heat for conversion to electrical power

Delivers power generation densities >5 W/cm² well in excess of those achieved using bulk materials

Ideal for waste heat conversion applications, the solid-state eTEG provides power in a form factor 20x thinner than conventional bulk material alternatives

Available with wires attached or with wire bondable pads

eTEG™ Power Generation Evaluation Kit
Nextreme eTEG UPF40 Evaluation Kit

Download Data Sheet | Application Note

An easy-to-use, self-contained evaluation kit for conducting desktop demonstrations of the UPF40 eTEG device.

Kit consists of a UPF40 eTEG power generator, a thick film heater, heat sink / fan assembly and two type K thermocouples

Driver Recommendations for Nextreme Modules
Download Application Note

Nextreme’s product portfolio includes modules that range in resistance from 50mΩ to 3Ω with corresponding Imax currents of 0.8A through 4A. The optimal drive current for these modules in an application is likely to be in the 0.2A to 1.5A range. Several off-the-shelf Thermoelectric Cooler Controllers or Temperature Controllers are available to drive and control Nextreme modules.

Cold-Side Temperature Sensing on Thin-Film TE Coolers
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Integrated temperature sensing of the cold-side of thin-film thermoelectric coolers is a challenge due to small surface area of the coolers’ top header. Micro-scale thermistors can be mounted either directly onto the top surface of the header or on the side of the top header to enable closed-loop temperature control.