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Nextreme Thermal Solutions Names New Chief Technology Officer
Embedded thermoelectric cooler technology firm adds thermal expert
Research Triangle Park, NC (February 7, 2007) - Nextreme, a manufacturer of advanced thin film thermoelectric components designed and produced to address the thermal management needs of the electronics, photonics, bio-tech and defense/aerospace industries, has recently appointed Dr. Seri Lee as Chief Technology Officer. Prior to joining Nextreme, Dr. Lee served as Senior Thermal Scientist for the Silicon and Platform Solutions Group at Intel Corporation, where he was responsible for executing corporate thermal directions for consumer products and technology development requirements. As an active member of the ASME Heat Transfer Division K-16 Committee on Heat Transfer in Electronic Equipment and the IEEE/SemiTherm Executive Committee, Dr. Lee brings a wide range of thermal management experience to Nextreme.
“I am excited to welcome Dr. Lee to Nextreme, as his experience is a part of our plan to build a world-class technology team focusing on electronic and opto-electronic packaging and thermal management,” said Jesko von Windheim, CEO at Nextreme. “I believe that Dr. Lee’s addition positions the company to address many of the most demanding issues in thermal management for advanced technology products; in addition, Dr. Lee will bring a new focus to the company’s efforts in the area of thermoelectric power generation.”
Dr. Lee has also previously held positions at Amkor Technology as Manager of Thermal Characterization, Aavid Thermal Technologies as Director of Advanced Thermal Engineering and at the University of Waterloo
in Ontario as Assistant Professor of Mechanical Engineering. “Throughout my career, I have enjoyed the challenge of directing thermal technology advancement projects,” said Dr. Lee. “I look forward to continuing that role and increasing our knowledge of our customers’ needs in order to offer them industry-leading solutions that will help them in all aspects of their business.”
In addition, Dr. Lee has organized numerous technical programs and sessions, published more than 60 technical papers and holds 16 patents covering a wide range of thermal issues in electronics. Dr. Lee served as the General Chair for the 1998 IEEE SemiTherm International Symposium, and in 2004 he received the best paper award from the ASME Journal of Heat Transfer Division.
“Dr. Lee is a great asset to Nextreme,” said Richard Harris, Chairman of the Board at Nextreme. “We look forward to his contributions as a member of Nextreme’s technology team to position the company for continued growth and success.”
For more information, contact Nextreme at 3908 Patriot Dr., Suite 140, Durham, NC 27703-8031; call (919)-597-7300; e-mail info@nextreme.com; or go to www.nextreme.com.
About Nextreme
Nextreme manufactures thin-film thermoelectric components that address most challenging thermal management and power generation needs of the semiconductor, photonics, consumer and defense/aerospace industries. Nextreme's miniature, thin-film eTEC offers an industry first — a micro-refrigerator the size of a piece of confetti that enables solid-state temperature control or power generation on a micro-scale, in close proximity source. eTECs operate as point-specific heat pumps for rapid cooling or heating of semiconductors and other electronics; for thermal management of fiber-optic laser controls integrated optoelectronics; or for power generation by converting otherwise wasted heat useful electricity.
Media Contact:
Paul Magill
919-593-2571
pmagill@nextreme.com
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