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Photonic devices are used universally to power the fiber optic backbone of our telecommunications system. Devices like laser diodes, photodiodes, and amplifiers all require thermoelectrics for wavelength stabilization, enhanced signal-to-noise ratio and cooling to enhance the power output of high-power lasers.
A major trend in telecommunications has been the move to more integrated packaging that is smaller and simpler in order to enable a lower cost structure. Most of the movement in this area has been to cheaper and smaller TO-Can style packaging. This move represents an order of magnitude or more decrease in the cost of producing these devices when compared to the butterfly packages used in the late 90s. Thin film TECs represent the only real technology alternative to integrate active thermal management into this type of packaging.
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OptoCooler UPF40 - ideal for opto-electronic applications with high heat-flux requirements, including but not limited to semiconductor optical amplifiers (SOA), laser diodes and LEDs.
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OptoCooler UPF4 - well suited for opto-electronics applications.
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eTEG UPF40 - thin film thermoelectric generator eTEG™ UPF40 converts heat into electrical power.
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The OptoCooler HV14 module is a RoHS-compliant, high voltage, low current thermoelectric cooler designed for commonly found board-level current and voltages.
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