Cooling, Heating & Power Generation.

Embedded Thermal Management
Nextreme designs and manufactures micro-scale thermal and power management products for pinpoint control of heat in highly engineered products. The Thermal Copper Pillar Bump provides integration of thermoelectric material into the widely accepted copper pillar bumping process for cooling and power generation applications in high-volume electronic packaging, particularly in flip chip applications.  One process provides thermal management capability for discrete (stand alone) devices, chip-level integration, and wafer-level integration.

Copper pillar bump (CPB) interconnect developed for high performance/high density electric interconnect is considered to be the future of flip chip.  This is an industry accepted solution, already being used by Intel (Presler, Yonah), Amkor, Casio and others. Thermal bumps employ electrical energy to pump heat out of a hot spot or into a specific region.

Nextreme's eTEC devices are produced on standard semiconductor processing equipment making the technology cost-effective and scalable to larger sizes. The technology is suited for use in areas such as electronics, micro-fluidics, optoelectronics/photonics, bioelectronics and test & measurement, among others.

Power Generation
Inherently, the technology can also be used to generate low levels of electricity from waste heat, by converting temperature differences of as little as 120°C into electrical energy. Applications include thermal batteries, powering distributed wireless sensor networks, generating power in remote environments, and harvesting energy from combustion sources.

Benefits

• Precision thermal management
• Enables hot spot cooling
• Integrated in a copper pillar bump close to the heat source
• High reliability
• Cost-effective
• Scalable to larger sizes
• Environmentally friendly
• Fast, thin, efficient

Features

• Temperature difference of up to 60 ºC
• High power density (>150W/cm²)
• Generate up to 10 mW of power per bump
• Ultra-small size: 60μm (0.06 mm) high
• Very fast response time (10ms)
• Solid-state design
• Semiconductor wafer fabrication

Contact us for spec sheets, evaluation, analysis, prototype, test, verification or production assistance, or call us at +1 919-597-7300.