Nextreme Thermal Solutions is Changing the Future of Thermal and Power Management

Nextreme designs and manufactures micro-scale thermal and power management products that overcome thermal and power constraints in electronics for applications in support of products for the telecom, consumer, test and measurement, industrial, automotive and government/aerospace markets.

The company has patented thin-film embedded cooling technology and power generation capabilities that have been incorporated into the widely accepted copper pillar bumping process used in high-volume electronic packaging.

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Experienced Leadership Team
Nextreme’s management team has introduced numerous new materials-based component technologies and has collectively exited >$1.4B in materials-based start-up activities. The team has worked together for ten years in multiple companies. Nextreme’s technology team is unparalleled, including world experts in thermal management, electronics packaging and semiconductor processing, all of whom have successfully introduced materials-based component breakthroughs to the market.

For more information contact Nextreme, Inc. at 3908 Patriot Dr., Suite 140, Durham, NC 27703-8031; call +1 919-597-7300 or e-mail info@nextreme.com.