|
|
Company Overview
Download Company Snapshot (pdf)
Nextreme Thermal Solutions: Changing the Future of Thermal and Power Management
Click to view a video on the Nextreme Story
Nextreme designs and manufactures micro-scale thermal and power management products for the semiconductor, photonics, consumer, automotive and defense/aerospace industries. The company has embedded cooling and power generation capabilities into the widely accepted copper pillar bumping process used in high-volume electronic packaging.
Breakthrough Technology
Nextreme’s breakthrough addresses the most challenging thermal and power management constraints in electronics today, and delivers the only fully-scalable technology solution by leveraging the existing, high-volume flip chip manufacturing infrastructure. By minimizing the need for manufacturing changes and focusing on developing a seamless design-in solution, Nextreme will change the future of thermal and power management for the entire electronics industry.
Experienced Leadership Team
Nextreme’s management team has introduced numerous new materials-based component technologies and has collectively exited >$1.4B in materials-based start-up activities. The team has worked together for ten years in multiple companies. Nextreme’s technology team is unparalleled, including world experts in thermal management, electronics packaging and semiconductor processing, all of whom have successfully introduced materials-based component breakthroughs to the market.
For more information contact Nextreme, Inc. at 3908 Patriot Dr., Suite 140, Durham, NC 27703-8031; call +1 919-597-7300 or e-mail info@nextreme.com.
|
